|
Products |
《back |
5mm圆头有边三脚双色 |
Items
|
Symbol
|
Absolute maximum Rating
|
Unit
|
R
|
B
|
Power Dissipation
|
PD
|
120
|
120
|
mW
|
Forward Current(DC)
|
IF
|
30
|
30
|
mA
|
Peak Forward Current*
|
IFP
|
100
|
100
|
mA
|
Operation Temperature
|
Topr
|
-40
~ +85
|
℃
|
Storage Temperature
|
Tstg
|
-40
~ +100
|
℃
|
Lead Soldering Temperature
|
Tsol
|
Max.260°C for 3 sec Max.
|
Items
|
Symbol
|
Condition
|
Min.
|
Typ.
|
Max.
|
Unit
|
Forward Voltage
|
R
|
VF
|
IF = 20mA
|
1.8
|
2.1
|
2.4
|
V
|
B
|
VF
|
IF = 20mA
|
3.0
|
3.2
|
3.4
|
V
|
Reverse Current
|
R
|
IR
|
VR = 5V
|
---
|
---
|
5
|
μΑ
|
B
|
IR
|
VR = 5V
|
---
|
---
|
5
|
μΑ
|
Dominant Wavelength
|
R
|
lD
|
IF = 20mA
|
620
|
625
|
630
|
nm
|
B
|
lD
|
IF = 20mA
|
460
|
465
|
470
|
nm
|
Luminous Intensity
|
R
|
IV
|
IF = 20mA
|
250
|
300
|
350
|
mcd
|
B
|
IV
|
IF = 20mA
|
350
|
400
|
450
|
mcd
|
注意事项
(一)LED焊接条件
(1)烙铁焊接:烙铁(最高30W)尖端温度不超过300℃;焊接时间不超过3秒;焊接位置至少离胶体2毫米。(2)浸焊:浸焊最高温度260℃;浸焊时间不超过5秒;浸焊位置至少离胶体2毫米。
(二)引脚成形方法
(1)必须离胶体2毫米才能折弯支架。(2)支架成形必须用夹具或由专业人员来完成。(3)支架成形必须在焊接前完成。(4)支架成形需保证引脚和间距与线路板上一致。 |
|
|
|